Lehrstuhl für Fertigungstechnologie, Universität Erlangen-Nürnberg

Fundamental investigation of cutting, forming and assembly injection moulding and their interdependence for manufacturing durable tight electronic systems - Phase 2

Project Status: finished


Due to the increasing number of electronic systems within vehicles and machines, there is a rising demand of tight sealed, robust electronic components. The encapsulation of shear cut metal inserts by means of assembly injection molding represents an economical process for manufacturing electronic components and connectors. So far, the only way to achieve tight sealing is by additional elaborate processing.

Main objective of the project is to reveal the potentials, limitations and correlations of the process steps cutting, forming and assembly injection molding in respect of a short and robust process chain. Therefore in cooperation with the Institute of Polymer Technology (LKT) each process stage will be investigated regarding mechanical, geometrical and process-related factors influencing the adhesion between insert and enclosing plastic as well as the crack initiation within the plastic.

Typical process chain for manufacturing plastic-metall hybrid parts, containing the process steps cutting, forming and assembly injection molding

Research Groups



    • Degner, J.; Herrmann, J.; Junker, F.; Berendt, E.; Merklein, M.:
      Leichtbauwerkstoffe für den modernen Automobilbau.
      Zeitschrift Konstruktion 3(2018), pp. 50-54

    • Heinel, M.; Frey, P.; Merklein, M.; Drummer, D.:
      Einfluss mikrogeformter Kanten an Metalleinlegern auf die Temperaturwechselbeständigkeit mediendichter Kunststoff-Metall-Hybriden.
      Zeitschrift Kunststofftechnik 14(2018)3, pp. 211-232


    • Frey, P.; Höhler, C.; Merklein, M.:
      Effect of Residual Stress on the Distortion of Microembossed Metal Inserts for Assembly Injection Moulding.
      In: Tosello, G.; Nørgaard Hansen, H.; Ehmann, K.; Dimov, S. (Edtrs.): 4M/IWMF2016 Conference: Proceedings of 11th International Conference on Multi-Material Micro Manufacture, 2016, pp. 691


    • Frey, P.; Heinle, M.; Leisen, C.; Drummer, D.; Merklein, M.:
      Embossing of Metal Inserts for Subsequent Assembly Injection Moulding of Media Tight Electronic Systems.
      KEM (Key Engineering Materials) 639(2015), pp. 99-106

    • Frey, P.; Heinle, M.; Drummer, D.; Merklein, M.:
      Influence of Metal Inserts with Microformed Edges on Subsequent Injection Assembly Moulding for Media Tight Electronic Systems.
      In: Qin, Y.; Dean; T.A.; Lin, J; Yuan, S. J.; Vollertsen, F. (Edtrs.): New Forming Technology 2015 - Proceedings of the 4th ICNFT, MATEC Web of Conferences, 2015, pp. 09013. 1-7

    Letztes Update: 26.07.2018