Lehrstuhl für Fertigungstechnologie, Universität Erlangen-Nürnberg

Investigation of the process sequence metal forming, placing and laser beam soldering of micro contacts

Datum: 12.11.1998



  • Prof. Dr.-Ing. Dr.h.c. M. Geiger
  • Prof. Dr.-Ing. K.Feldmann, Erlangen

For many years the micro joining technique as a part of the electronic production has been characterized by miniaturization and the demand on higher process reliability, productivity and quality. The conventional methods of manufacturing electronic components with a high lead count and a lead pitch less then 400 m are reaching their limits. To demonstrate to what extent laser beam soldering has the potential to expand these technological limitations, investigations were made in the field of system and process techniques using a micro processing machine constructed for this purpose. The joining process was regarded as an integrated part of the whole manufacturing process, making it possible to demonstrate the influence of the material characteristics and the process parameters in their single process pass over effects. Priority was given to shortening the process duration as well as quality of the joints reached by laser beam soldering. By using solid solder deposits and a touch-down-force placing, good soldering joints could be realized with process durations less than 10 ms. The investigated process sequence consisted of the individual processes: metal forming of the component leads, placing of the component on the printed circuit board (PCB) and the joining of the leads with the lands of the PCB.