Lehrstuhl für Fertigungstechnologie, Universität Erlangen-Nürnberg

Laser assisted generation of circuit structures on thermoplastics for MID technology



Datum: 17.04.2002


Author


Reporter

  • Prof. Dr.-Ing. M. Geiger
  • Prof. Dr. rer. nat. R. Poprawe M.A., Fraunhofer ILT Aachen

The advantages resulting from the integration of electric and mechanical functions in three-dimensional plastic components will lead to an increasing replacement of conventional electronic componentries by thermoplastic MIDs. Laser structuring of 3D-MIDs - i.e. the creation of electrically conductive structures with the laser - is superior to alternative production methods not only regarding the achievable structure resolutions but also regarding flexibility. So far, however, little-sophisticated structuring systems and structuring methods that do not fully meet the requirements of MID technology have been obstacles bringing laser-structured 3D-MIDs onto the market at a large scale. Therefore, this thesis work undertook basic investigations on the construction of tool components for laser structuring of 3D-MIDs and developed new approaches to the problem of creating conductor patterns on thermoplastic substrate materials. The implementation of a 3D beam deflection module was successfully used for producing prototypes of 3D-MID components while investigating applications. The idea of a new structuring method for thermoplastic circuit carriers that meets the main MID demands of "3D suitability" and "independence from the basic material" was both verified in experiments and analyzed in detail. An application example demonstrated in principle that the examined structuring method is suitable for practical use.