Lehrstuhl für Fertigungstechnologie, Universität Erlangen-Nürnberg

Process behaviour of silicon as tool material for micro blanking of thin metal foils



Datum: 14.12.2016


Author


Reporter

  • Prof. Dr.-Ing. habil. M. Merklein
  • Prof. Dr.-Ing. M. Schmidt

The trend towards further miniaturisation and functional integration of electronic products and metallic components causes high demands on tools for mechanical manufacturing processes. Traditional tool production methods reach their economical and technical limits. Consequently, within this work a wafer-based approach applying silicon etching was chosen for the manufacture of micro punches with widths under 100 µm for blanking of thin copper foils. The main challenge for using silicon as tool material is its high brittleness, resulting in cracks and fracture within the blanking process. Based on experimental investigations and FE-simulations a fundamental knowledge about the process behaviour of silicon as tool material for micro blanking of thin copper foils was created. The applicability of this information was demonstrated by a modification of the cutting edge geometry as well as by the evaluation and avoidance of critical process errors within blanking, which leads to decreased tool loads and finally higher tool life