Lehrstuhl für Fertigungstechnologie, Universität Erlangen-Nürnberg



Local Stiffening and Processing of Rigid-Flexible Circuit Boards Based on Polysiloxane by Laser Radiation



Project Status: finished

Members


An alternative to conventional substrate materials for flexible circuits is the extremely flexible, highly thermally conductive and temperature stable polysiloxane sheet. In order to realize an inexpensive production from roll to roll, a laser beam machining of this new material is necessary. Therefore the material-radiation-interactions are under research within this project and are transferred to the domains laser beam cutting, structuring and drilling. The laser beam drilling of this composite material is essential for a later realization of a multilayer buildup. By different laser beam drilling strategies holes in the range of 100 µm up to a few millimeters in diameter are possible. The method of laser beam direct structuring allows the production of conductors with a minimal line widths of 50 µm and a minimal spacing of 35 µm. The local stiffening of the flexible circuit is done by an additional printed polymeric system, which is crosslinked by a laser initiated process.


Letztes Update: 28.04.2010