Lehrstuhl für Fertigungstechnologie, Universität Erlangen-Nürnberg



Laser Supported Reflow Soldering for 3-D MID



Project Status: finished

Members


Due to their locally and temporarily limited heat input, selective soldering techniques like laser soldering are convenient for the joining of SMDs on thermoplastics. Investigations of simultaneous laser soldering with light lines have proven that soldering of SO-components, even on ABS with its low thermal resistance, is possible. However, a too large energy input may lead to a pore formation below the metallization which causes a reduction of the adhesion of the metallization. Depending on the process parameters, the temperature at the interface between metallization and substrate exceeds 300 °C and more, according to measurements during soldering. These temperatures can lead to the above mentioned pore formation.


Letztes Update: 27.04.2010