Lehrstuhl für Fertigungstechnologie, Universität Erlangen-Nürnberg



Lead Parameter Recording of SMT-Devices



Project Status: finished

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Within this research topic a novel measurement system for lead-geometry-inspection of SMDs is developed. In contrast to presently employed setups the normal direction of the device does not run parallel with the camera axis. The device is tilted twice against it. Additionally, the conventional CCD matrix camera is replaced by a CCD-line to provide high-resolution images by scanning the leads. The evaluation of the resulting line-scans is divided into two steps. The first step features a wavelet analysis of several image rows to yield information of the periodicity of the current lead row. Within the second step critical leads, detected by the wavelet analysis, are examined. After performing an edge detection algorithm, the following lead parameters can be extracted: length, width, height, three possible rotation angles and - in certain limits - three possible translations of a single lead.


Letztes Update: 28.04.2010