Lehrstuhl für Fertigungstechnologie, Universität Erlangen-Nürnberg

Laser Assisted Patterning of Three-Dimensional Molded Interconnect Devices

Project Status: finished


For 3D laser micro processing, an off-line programming system is being developed. The system allows an automatic off-line generation of NC-programs for different machining tools. Based on a 3D-CAD model of the three-dimensional molded interconnect device 3-D MID with its circuit layout, the system is capable of creating the manufacturing steps. Besides the possibilities of the technological attribution, resp. manual changing of the machining contours, the path planning procedures, a complete collision detection and the NC code generation, another essential objective is the realistic simulation of the laser assisted structuring process. The path planning algorithm for micro processing involves the use of a three axes scanner head and a five axes handling tool. To solve the complex kinematics of 8 axes, the planning procedures are divided in two parts: the mechanical positioning and the optical processing. This approach leads to a fast computation of the machining path.

Letztes Update: 27.04.2010