Lehrstuhl für Fertigungstechnologie, Universität Erlangen-Nürnberg

Laser Assisted Patterning of Three-Dimensional Molded Interconnect Devices

Project Status: finished


After previous basic research to optimize the chemical composition of the used resists, the process window for laser structuring with ablation and exposure was determined experimentally. The experiments based on laser parameters and processing speed were conducted mainly with planar test pieces. In addition, a 3-D focus position control was integrated into the laser processing system realized in this project; its use makes it possible to transfer the structuring techniques to three-dimensional parts. At the end of the project, these parts will also function as demonstrators for the efficiency of the different technologies. It was also possible to qualify a new, additive metallization technique lift-off technique for laser processing of MID.

Letztes Update: 27.04.2010